Floorbond XMS Subfloor adhesive, based on hybrid technology, is a high strength, high performance, flexible general purpose construction adhesive designed primarily for use in installing particleboard (red, yellow and green tongue) flooring over timber joists where nail ride/squeak is to be eliminated.
Floorbond XMS Subfloor adhesive is also suitable for use in building and construction applications where a strong yet flexible bond is required over a variety of substrates. Floorbond XMS Subfloor adhesive is ready to use with no mixing required. The adhesive creates a strong, permanently flexible bond. It is non toxic and easy to clean up. Floorbond XMS Subfloor adhesive cures by means of a chemical reaction within the adhesive and atmospheric moisture. Once fully cured (approx 24hrs at 23°C and 50%RH) an elastic and non shrinkable adhesive layer is formed which is resistant to moisture and heat. The adhesive has excellent adhesion to most common substrates used in the construction industry. The adhesive contains no water or solvents, minimizing the risk of deforming timber flooring.
Do not install to substrates that are not protected from rising damp
Do not apply the adhesive below 10°C or above 35°C
Do not apply the adhesive when the relative humidity is above 75%
Do not install if the walls and ceilings of the area are not dry (eg after plastering or painting etc)
Bonding particleboard subfloors (red, green and yellow) tongue to timber joists where traditional construction adhesives can become brittle and crack over time resulting in clicking/nail squeak
Bonding metal joist systems to particleboard subfloors (refer HB Fuller technical department for approved metal joist systems)
Timber and metal wall frame and truss bonding
Bonding many types of building construction materials on site
Suitable for porous and non porous substrates
Suitable for floors with underfloor heating - see installation notes
In areas where movement needs to be absorbed
Cut tip off cartridge. Angle nozzle to desired size. Screw nozzle onto cartridge. Apply product to one surface to be bonded.
Before product skins, mate with other surface. When bonding particleboard subfloor to joists,apply a 5mm bead of adhesive along the entire length of the joist to be bonded, then fix particleboard subfloor on to joist, ensuring full contact with the joist. Fasten using mechanical fastenings in conjunction with the use of Floorbond XMS Subfloor. When bonding a sheet or panel to a large, flat surface, apply sufficient adhesive to trowel out for full coverage bonding.
Press into position and brace until set.
Any flooring application to full surface (eg concrete or plywood) must be fully bonded, that is a full layer of adhesive over the entire area (spot gluing or bead application is not recommended).
Temporary or mechanical fixing may be required depending upon substrates. Bond will develop dependent upon thickness of adhesive and ambient conditions. Higher humidity and warmer temperatures will hasten bond development. Minimum film thickness for bonding applications is approx 1mm.